Peter Jacob

Orcid: 0000-0001-6684-7173

According to our database1, Peter Jacob authored at least 17 papers between 2004 and 2021.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
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Links

On csauthors.net:

Bibliography

2021
Toward an Optimal Definition of Hypoglycemia with Continuous Glucose Monitoring.
Comput. Methods Programs Biomed., 2021

2017
New ESD challenges in RFID manufacturing.
Microelectron. Reliab., 2017

A very unusual transistor failure, caused by a solenoid.
Microelectron. Reliab., 2017

2016
Failure mechanisms and precautions in plug connectors and relays.
Microelectron. Reliab., 2016

Early life field failures in modern automotive electronics - An overview; root causes and precautions.
Microelectron. Reliab., 2016

2015
Failure analysis and reliability on system level.
Microelectron. Reliab., 2015

Unusual defects, generated by wafer sawing: An update, including pick&place processing.
Microelectron. Reliab., 2015

2013
Failure causes generating aluminium protrusion/extrusion.
Microelectron. Reliab., 2013

2011
From component to system failure analysis - The future challenge within work-sharing supply chains.
Microelectron. Reliab., 2011

Impact of IT-supported clinical pathways on medical staff satisfaction. A prospective longitudinal cohort study.
Int. J. Medical Informatics, 2011

2009
Reading distance degradation mechanisms of near-field RFID devices.
Microelectron. Reliab., 2009

2008
Unusual defects, generated by wafer sawing: Diagnosis, mechanisms and how to distinguish from related failures.
Microelectron. Reliab., 2008

Surface ESD (ESDFOS) in assembly fab machineries as a functional and reliability risk - Failure analysis, tool diagnosis and on-site-remedies.
Microelectron. Reliab., 2008

2007
Device decapsulated (and/or depassivated) - Retest ok - What happened?
Microelectron. Reliab., 2007

2006
Reliability and wearout characterisation of LEDs.
Microelectron. Reliab., 2006

2005
Electrostatic discharge directly to the chip surface, caused by automatic post-wafer processing.
Microelectron. Reliab., 2005

2004
Electrostatic Effects on Semiconductor Tools.
Microelectron. Reliab., 2004


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