Philippe Nivelle

According to our database, Philippe Nivelle authored at least 2 papers between 2018 and 2021.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2021

Introducing a Thermal-Based Method for Measuring Dynamic Thin Film Thickness in Real Time as a Tool for Sensing Applications.

Gilles Oudebrouckx, Thijs Vandenryt, Philippe Nivelle, Seppe Bormans, Patrick H. Wagner, Ronald Thoelen

IEEE Trans. Instrum. Meas., 2021

2018

Mechanical and chemical adhesion at the encapsulant interfaces in laminated photovoltaic modules.

Philippe Nivelle, Tom Borgers, Eszter Voroshazi, Jef Poortmans, Jan D'Haen, Ward De Ceuninck, Michael Daenen

Proceedings of the IEEE International Reliability Physics Symposium, 2018