Po-Yao Lin

Orcid: 0000-0001-6137-9948

According to our database1, Po-Yao Lin authored at least 2 papers between 2018 and 2022.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Links

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Bibliography

2022
Thermal Challenges for HPC 3DFabric<sup>TM</sup> Packages and Systems.
Proceedings of the IEEE International Reliability Physics Symposium, 2022

2018
SiO<sub>2</sub> tunneling and Si<sub>3</sub>N<sub>4</sub>/HfO<sub>2</sub> trapping layers formed with low temperature processes on gate-all-around junctionless charge-trapping flash memory devices.
Microelectron. Reliab., 2018


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