R. Leroy

According to our database, R. Leroy authored at least 2 papers between 2012 and 2015.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2015

Impact of aluminum wire and ribbon bonding technologies on D²PAK package reliability during thermal cycling applications.

Sébastien Jacques, R. Leroy, Marc Lethiecq

Microelectron. Reliab., 2015

2012

Lifetime prediction modeling of non-insulated TO-220AB packages with lead-based solder joints during power cycling.

Sébastien Jacques, A. Caldeira, N. Batut, A. Schellmanns, R. Leroy, L. Gonthier

Microelectron. Reliab., 2012