Raj Sekar Sethu

According to our database, Raj Sekar Sethu authored at least 2 papers between 2015 and 2016.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2016

Reliability evaluation of tungsten donut-via as an element of the highly robust metallization.

Verena Hein, Marco Erstling, Raj Sekar Sethu, Kirsten Weide-Zaage, Tianlin Bai

Microelectron. Reliab., 2016

2015

Characterization of copper precipitates on aluminum copper bond pads formed after plasma clean and de-ionized water exposure.

Raj Sekar Sethu, Hong Seng Ng, Alvin Chan, Cheng Nee Ong, Sieng Fong Chan

Microelectron. Reliab., 2015