Kirsten Weide-Zaage

According to our database, Kirsten Weide-Zaage authored at least 30 papers between 2001 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2023

Radiation Tolerant Reconfigurable Hardware Architecture Design Methodology.

Eike Trumann, Gia Bao Thieu, Johannes Schmechel, Kirsten Weide-Zaage, Katharina Schmidt, Dorian Hagenah, Guillermo Payá Vayá

Proceedings of the Applied Reconfigurable Computing. Architectures, Tools, and Applications, 2023

2017

Simulation of packaging under harsh environment conditions (temperature, pressure, corrosion and radiation).

Kirsten Weide-Zaage

Microelectron. Reliab., 2017

2016

Reliability evaluation of tungsten donut-via as an element of the highly robust metallization.

Verena Hein, Marco Erstling, Raj Sekar Sethu, Kirsten Weide-Zaage, Tianlin Bai

Microelectron. Reliab., 2016

Effects of salt spray test on lead-free solder alloy.

Alexandrine Guédon-Gracia, Hélène Frémont, Bernard Plano, Jean-Yves Delétage, Kirsten Weide-Zaage

Microelectron. Reliab., 2016

2015

Effect of thermal aging on the electrical resistivity of Fe-added SAC105 solder alloys.

Mohd Faizul Mohd Sabri, Nor Ilyana Muhd Nordin, Suhana Mohd Said, Nur Aishah Aminah Mohd Amin, Hamzah Arof, Iswadi Jauhari, Roziana Ramli, Kirsten Weide-Zaage

Microelectron. Reliab., 2015

Dynamical IMC-growth calculation.

Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont

Microelectron. Reliab., 2015

Electro- and thermomigration induced Cu₃Sn and Cu₆Sn₅ formation in SnAg_3.0Cu_0.5 bumps.

Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage, Bernard Plano

Microelectron. Reliab., 2015

2014

Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic core.

Kirsten Weide-Zaage, J. Schlobohm, R. T. H. Rongen, F. C. Voogt, R. Roucou

Microelectron. Reliab., 2014

Reliability of Wafer Level Chip Scale Packages.

R. T. H. Rongen, R. Roucou, P. J. vd Wel, F. C. Voogt, F. Swartjes, Kirsten Weide-Zaage

Microelectron. Reliab., 2014

Degradation behavior in upstream/downstream via test structures.

Jörg Kludt, Kirsten Weide-Zaage, Markus Ackermann, Verena Hein, Christian Kovács

Microelectron. Reliab., 2014

Evaluation new corner stress relief structure layout for high robust metallization.

Verena Hein, Jörg Kludt, Kirsten Weide-Zaage

Microelectron. Reliab., 2014

Qualification procedure for moisture in embedded capacitors.

Hélène Frémont, Jörg Kludt, Massar Wade, Kirsten Weide-Zaage, Isabelle Bord-Majek, Geneviève Duchamp

Microelectron. Reliab., 2014

Simulation in 3D integration and TSV.

Kirsten Weide-Zaage, Aymen Moujbani, Jörg Kludt

Proceedings of the IEEE 5th Latin American Symposium on Circuits and Systems, 2014

2013

Dynamic simulation of migration induced failure mechanism in integrated circuit interconnects.

Aymen Moujbani, Jörg Kludt, Kirsten Weide-Zaage, Markus Ackermann, Verena Hein, Lutz Meinshausen

Microelectron. Reliab., 2013

Electro- and thermomigration-induced IMC formation in SnAg_3.0Cu_0.5 solder joints on nickel gold pads.

Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage, Bernard Plano

Microelectron. Reliab., 2013

Dynamic simulation of octahedron slotted metal structures.

Jörg Kludt, Kirsten Weide-Zaage, Markus Ackermann, Verena Hein

Microelectron. Reliab., 2013

2012

Electro- and thermo-migration induced failure mechanisms in Package on Package.

Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont

Microelectron. Reliab., 2012

Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers.

Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage

Microelectron. Reliab., 2012

Simulation of the influence of TiAl₃ layers on the thermal-electrical and mechanical behaviour of Al metallizations.

Jörg Kludt, Kirsten Weide-Zaage, Markus Ackermann, Verena Hein

Microelectron. Reliab., 2012

A design for robust wide metal tracks.

Markus Ackermann, Verena Hein, Christian Kovács, Kirsten Weide-Zaage

Microelectron. Reliab., 2012

2011

Migration induced material transport in Cu-Sn IMC and SnAgCu microbumps.

Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont

Microelectron. Reliab., 2011

Influence of air gaps on the thermal-electrical-mechanical behavior of a copper metallization.

Irina Bauer, Kirsten Weide-Zaage, Lutz Meinshausen

Microelectron. Reliab., 2011

2009

Investigation of stress distribution in via bottom of Cu-via structures with different via form by means of submodeling.

Joharsyah Ciptokusumo, Kirsten Weide-Zaage, Oliver Aubel

Microelectron. Reliab., 2009

2008

Determination of migration effects in Cu-via structures with respect to process-induced stress.

Kirsten Weide-Zaage, Jiani Zhao, Joharsyah Ciptokusumo, Oliver Aubel

Microelectron. Reliab., 2008

Simulation of migration effects in nanoscaled copper metallizations.

Kirsten Weide-Zaage, Farzan Kashanchi, Oliver Aubel

Microelectron. Reliab., 2008

2007

Dynamic void formation in a DD-copper-structure with different metallization geometry.

Kirsten Weide-Zaage, David Dalleau, Yves Danto, Hélène Frémont

Microelectron. Reliab., 2007

2005

Moisture diffusion in Printed Circuit Boards: Measurements and Finite- Element- Simulations.

Kirsten Weide-Zaage, Walter Horaud, Hélène Frémont

Microelectron. Reliab., 2005

2004

How to study delamination in plastic encapsulated devices.

Hélène Frémont, Jean-Yves Delétage, Kirsten Weide-Zaage, Yves Danto

Microelectron. Reliab., 2004

2003

Simulation of time depending void formation in copper, aluminum and tungsten plugged via structures.

David Dalleau, Kirsten Weide-Zaage, Yves Danto

Microelectron. Reliab., 2003

2001

Three-Dimensional Voids Simulation in chip Metallization Structures: a Contribution to Reliability Evaluation.

David Dalleau, Kirsten Weide-Zaage

Microelectron. Reliab., 2001