Rolf Aschenbrenner

According to our database, Rolf Aschenbrenner authored at least 8 papers between 2002 and 2015.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2015

From fan-out wafer to fan-out panel level packaging.

Tanja Braun, K.-F. Becker, S. Raatz, V. Bader, Jörg Bauer, Rolf Aschenbrenner, S. Voges, Tina Thomas, R. Kahle, Klaus-Dieter Lang

Proceedings of the European Conference on Circuit Theory and Design, 2015

2006

High-temperature reliability of Flip Chip assemblies.

Tanja Braun, Karl-Friedrich Becker, Mathias Koch, Volker Bader, Rolf Aschenbrenner, Herbert Reichl

Microelectron. Reliab., 2006

Fully Integrated EKG Shirt based on Embroidered Electrical Interconnections with Conductive Yarn and Miniaturized Flexible Electronics.

Torsten Linz, Christine Kallmayer, Rolf Aschenbrenner, Herbert Reichl

Proceedings of the 2006 International Workshop on Wearable and Implantable Body Sensor Networks (BSN 2006), 2006

2005

Reliability Potential Of Epoxy Based Encapsulants For Automotive Applications.

Tanja Braun, Karl-Friedrich Becker, Mathias Koch, Volker Bader, Rolf Aschenbrenner, Herbert Reichl

Microelectron. Reliab., 2005

Embroidering Electrical Interconnects with Conductive Yarn for The Integration of Flexible Electronic Modules into Fabric.

Torsten Linz, Christine Kallmayer, Rolf Aschenbrenner, Herbert Reichl

Proceedings of the Ninth IEEE International Symposium on Wearable Computers (ISWC 2005), 2005

2004

Long time reliability study of soldered flip chips on flexible substrates.

Barbara Pahl, Christine Kallmayer, Rolf Aschenbrenner, Herbert Reichl

Microelectron. Reliab., 2004

Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping.

Dionysios Manessis, Rainer Patzelt, Andreas Ostmann, Rolf Aschenbrenner, Herbert Reichl

Microelectron. Reliab., 2004

2002

Bump formation for flip chip and CSP by solder paste printing.

Joachim Kloeser, Paradiso Coskina, Rolf Aschenbrenner, Herbert Reichl

Microelectron. Reliab., 2002