S. E. Kucuk Eroglu

According to our database1, S. E. Kucuk Eroglu authored at least 1 paper in 2016.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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PhD thesis 
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Links

On csauthors.net:

Bibliography

2016
Copper TSV-based die-level via-last 3D integration process with parylene-C adhesive bonding technique.
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016


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