S. Söhl

According to our database¹, S. Söhl authored at least 2 papers between 2017 and 2018.

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2018

Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects - A novel approach for hybrid metal baseplates.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2018

2017

Strength and reliability of low temperature transient liquid phase bonded Cu-Sn-Cu interconnects.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2017