Vladimir N. Popok

According to our database, Vladimir N. Popok authored at least 8 papers between 2013 and 2018.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2018

Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects - A novel approach for hybrid metal baseplates.

Mads Brincker, Peter Kjær Kristensen, S. Söhl, R. Eisele, Vladimir N. Popok

Microelectron. Reliab., 2018

2017

Wire bond degradation under thermo- and pure mechanical loading.

Kristian Bonderup Pedersen, Dennis A. Nielsen, Bernhard Czerny, Golta Khatibi, Francesco Iannuzzo, Vladimir N. Popok, Kjeld Pedersen

Microelectron. Reliab., 2017

Strength and reliability of low temperature transient liquid phase bonded Cu-Sn-Cu interconnects.

Mads Brincker, S. Söhl, R. Eisele, Vladimir N. Popok

Microelectron. Reliab., 2017

2016

Comprehensive physical analysis of bond wire interfaces in power modules.

Vladimir N. Popok, Kristian Bonderup Pedersen, Peter Kjær Kristensen, Kjeld Pedersen

Microelectron. Reliab., 2016

Mechanisms of metallization degradation in high power diodes.

Mads Brincker, Peter Kjær Kristensen, Kristian Bonderup Pedersen, Vladimir N. Popok

Microelectron. Reliab., 2016

2015

Degradation mapping in high power IGBT modules using four-point probing.

Kristian Bonderup Pedersen, Lotte Haxen Østergaard, Pramod Ghimire, Vladimir N. Popok, Kjeld Pedersen

Microelectron. Reliab., 2015

Effects of thermal cycling on aluminum metallization of power diodes.

Mads Brincker, Kristian Bonderup Pedersen, Peter Kjær Kristensen, Vladimir N. Popok

Microelectron. Reliab., 2015

2013

Micro-sectioning approach for quality and reliability assessment of wire bonding interfaces in IGBT modules.

Kristian Bonderup Pedersen, Peter Kjær Kristensen, Vladimir N. Popok, Kjeld Pedersen

Microelectron. Reliab., 2013