S. W. Ricky Lee

According to our database, S. W. Ricky Lee authored at least 6 papers between 2009 and 2016.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2016

Experimental investigation of the failure mechanism of Cu-Sn intermetallic compounds in SAC solder joints.

Chaoran Yang, Fuliang Le, S. W. Ricky Lee

Microelectron. Reliab., 2016

2014

Impact of Ni concentration on the intermetallic compound formation and brittle fracture strength of Sn-Cu-Ni (SCN) lead-free solder joints.

Chaoran Yang, Fubin Song, S. W. Ricky Lee

Microelectron. Reliab., 2014

2012

Moldless encapsulation for LED wafer level packaging using integrated DRIE trenches.

Rong Zhang, S. W. Ricky Lee

Microelectron. Reliab., 2012

Reliability of high-power LED packaging and assembly.

Cheng-Yi Liu, S. W. Ricky Lee, Moo Whan Shin, Yi-Shao Lai

Microelectron. Reliab., 2012

2011

Investigation on copper diffusion depth in copper wire bonding.

Catherine H. Chen, Shawn X. Zhang, S. W. Ricky Lee, Lebbai Mohamed

Microelectron. Reliab., 2011

2009

Experimental investigations and model study of moisture behaviors in polymeric materials.

X. J. Fan, S. W. Ricky Lee, Q. Han

Microelectron. Reliab., 2009