Sayoon Kang

According to our database, Sayoon Kang authored at least 2 papers between 2006 and 2008.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2008

Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling.

Yoshikuni Nakadaira, Seyoung Jeong, Jongbo Shim, Jaiseok Seo, Sunhee Min, Taeje Cho, Sayoon Kang, Seyong Oh

Microelectron. Reliab., 2008

2006

A numerical failure analysis on lead breakage issues of ultra fine pitch flip chip-on-flex and tape carrier packages during chip/film assembly process.

Changsoo Jang, Seongyoung Han, Hangyu Kim, Sayoon Kang

Microelectron. Reliab., 2006