Seungjun Noh

Orcid: 0000-0003-3477-8120

According to our database1, Seungjun Noh authored at least 2 papers in 2018.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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PhD thesis 
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Links

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Bibliography

2018
Large-area die-attachment by silver stress migration bonding for power device applications.
Microelectron. Reliab., 2018

Influence of thermal exposure upon mechanical/electrical properties and microstructure of sintered micro-porous silver.
Microelectron. Reliab., 2018


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