Katsuaki Suganuma

According to our database, Katsuaki Suganuma authored at least 12 papers between 2007 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2018

Large-area die-attachment by silver stress migration bonding for power device applications.

Seungjun Noh, Hao Zhang, Jeyun Yeom, Chuantong Chen, Caifu Li, Katsuaki Suganuma

Microelectron. Reliab., 2018

Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure.

Dongjin Kim, Chuantong Chen, Aiji Suetake, Chanyang Choe, Tohru Sugahara, Shijo Nagao, Katsuaki Suganuma

Microelectron. Reliab., 2018

Influence of thermal exposure upon mechanical/electrical properties and microstructure of sintered micro-porous silver.

Chanyang Choe, Seungjun Noh, Chuantong Chen, Dongjin Kim, Katsuaki Suganuma

Microelectron. Reliab., 2018

2015

Power electronics packaging.

Katsuaki Suganuma, Jenn-Ming Song, Yi-Shao Lai

Microelectron. Reliab., 2015

Electromigration behavior in Cu/Ni-P/Sn-Cu based joint system with low current density.

Takuya Kadoguchi, Keisuke Gotou, Kimihiro Yamanaka, Shijo Nagao, Katsuaki Suganuma

Microelectron. Reliab., 2015

2014

Introduction to Printed Electronics

Katsuaki Suganuma

Springer Briefs in Electrical and Computer Engineering, Springer, ISBN: 978-1-4614-9625-0, 2014

Evaluation of Stretchable Conductor for Measuring Clothing Pressure.

Katsunari Sato, Sayasa Otsubo, Teppei Araki, Tohru Sugahara, Katsuaki Suganuma

Proceedings of the Haptics: Neuroscience, Devices, Modeling, and Applications, 2014

2012

Effects of Cu contents in flux on microstructure and joint strength of Sn-3.5Ag soldering with electroless Ni-P/Au surface finish.

Hitoshi Sakurai, Keun-Soo Kim, Kiju Lee, Chang-Jae Kim, Youichi Kukimoto, Katsuaki Suganuma

Microelectron. Reliab., 2012

2011

Influence of crystallographic orientation of Sn-Ag-Cu on electromigration in flip-chip joint.

Kiju Lee, Keun-Soo Kim, Yutaka Tsukada, Katsuaki Suganuma, Kimihiro Yamanaka, Soichi Kuritani, Minoru Ueshima

Microelectron. Reliab., 2011

2007

Studies on solder bump electromigration in Cu/Sn-3Ag-0.5Cu/Cu system.

Kimihiro Yamanaka, Yutaka Tsukada, Katsuaki Suganuma

Microelectron. Reliab., 2007

Properties of low temperature Sn-Ag-Bi-In solder systems.

Keun-Soo Kim, Takayuki Imanishi, Katsuaki Suganuma, Minoru Ueshima, Rikiya Kato

Microelectron. Reliab., 2007

A flexible and stretchable tactile sensor utilizing static electricity.

Yasunori Tada, Masahiro Inoue, Toshimi Kawasaki, Yasushi Kawahito, Hiroshi Ishiguro, Katsuaki Suganuma

Proceedings of the 2007 IEEE/RSJ International Conference on Intelligent Robots and Systems, October 29, 2007