Shigeru Sawada

According to our database, Shigeru Sawada authored at least 8 papers between 2008 and 2017.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of four.

2017

Effect of Hardness on Wear and Abrasion Resistance of Silver Plating on Copper Alloy.

Shigeru Sawada, Song-Zhu Kure-Chu, Rie Nakagawa, Toru Ogasawara, Hitoshi Yashiro, Yasushi Saitoh

IEICE Trans. Electron., 2017

2012

Deformation of Crystal Morphology in Tin Plated Contact Layer Caused by Loading.

Terutaka Tamai, Shigeru Sawada, Yasuhiro Hattori

IEICE Trans. Electron., 2012

2010

Contact Mechanisms and Contact Resistance Characteristics of Solid Tin and Plated Tin Contacts Used for Connectors.

Terutaka Tamai, Shigeru Sawada, Yasuhiro Hattori

IEICE Trans. Electron., 2010

Numerical Analyses for Contact Resistance due to Constriction Effect of Current Flowing through Multi-Spot Construction.

Shigeru Sawada, Terutaka Tamai, Yasuhiro Hattori, Kazuo Iida

IEICE Trans. Electron., 2010

Constriction Resistance Behavior of a Tin or Silver Plated Layer for an Electrical Contact.

Shigeru Sawada, Kaori Shimizu, Yasuhiro Hattori, Terutaka Tamai

IEICE Trans. Electron., 2010

2009

Contact Area Analysis by FEM with Plating Layer for Electrical Contact.

Kaori Shimizu, Shigeki Shimada, Shigeru Sawada, Yasuhiro Hattori

IEICE Trans. Electron., 2009

Influence of Fretting Wear on Lifetime of Tin Plated Connectors.

Hirosaka Ikeda, Tetsuya Ito, Shigeru Sawada, Yasuhiro Hattori, Yasushi Saitoh, Terutaka Tamai, Kazuo Iida

IEICE Trans. Electron., 2009

2008

Micro-Structural Study of Fretting Contact Caused by the Difference of the Tin Plating Thickness.

Tetsuya Ito, Shigeru Sawada, Yasuhiro Hattori, Yasushi Saitoh, Terutaka Tamai, Kazuo Iida

IEICE Trans. Electron., 2008