Si Chen
Orcid: 0000-0002-9105-6274Affiliations:
- China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou, China
- Beijing University of Technology, College of Mechanical Engineering and Applied Electronics Technology, China (PhD 2017)
According to our database1,
Si Chen
authored at least 4 papers
between 2016 and 2022.
Collaborative distances:
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Bibliography
2022
Life assessment method of electronic components based on reliability factor sharing model.
Proceedings of the 5th International Conference on Algorithms, 2022
2020
Simulation Analysis of Mechanical Response of Wire Bonding in SiP under Thermal-mechanical-electrical Coupling Load.
Proceedings of the 2020 IEEE International Conference on Integrated Circuits, 2020
2018
The experimental analysis and the mechanical model for the debonding failure of TSV-Cu/Si interface.
Microelectron. Reliab., 2018
2016
Protrusion of electroplated copper filled in through silicon vias during annealing process.
Microelectron. Reliab., 2016