Simon Chua

According to our database, Simon Chua authored at least 1 paper in 2003.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2003

Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages.

T. Y. Lin, K. L. Davison, W. S. Leong, Simon Chua, Y. F. Yao, J. S. Pan, J. W. Chai, K. C. Toh, W. C. Tjiu

Microelectron. Reliab., 2003