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T. Y. Lin

This page is a disambiguation page, it actually contains mutiple papers from persons of the same or a similar name.

Bibliography

2012
Sequential quadratic programming method with a global search strategy on the cutting-stock problem with rotatable polygons.
[BibTeX]
[DOI]
M. T. Yu
,
T. Y. Lin
,
C. Hung
J. Intell. Manuf., 2012

Classifying twitter data with Naïve Bayes Classifier.
[BibTeX]
[DOI]
Chris Tseng
,
Nishant Patel
,
Hrishikesh Paranjape
,
T. Y. Lin
,
SooTee Teoh
Proceedings of the 2012 IEEE International Conference on Granular Computing, 2012

2005
New encapsulation development for fine pitch IC devices.
[BibTeX]
[DOI]
Y. F. Yao
,
B. Njoman
,
K. H. Chua
,
T. Y. Lin
Microelectron. Reliab., 2005

Introduction.
[BibTeX]
[DOI]
Wesley W. Chu
,
T. Y. Lin
Appl. Intell., 2005

Reasoning about relational granulation in modal logics.
[BibTeX]
[DOI]
Churn-Jung Liau
,
T. Y. Lin
Proceedings of the 2005 IEEE International Conference on Granular Computing, 2005

Kolmogorov complexity based automata modeling for intrusion detection.
[BibTeX]
[DOI]
Priya Baliga
,
T. Y. Lin
Proceedings of the 2005 IEEE International Conference on Granular Computing, 2005

2004
The impact of moisture in mold compound preforms on the warpage of PBGA packages.
[BibTeX]
[DOI]
T. Y. Lin
,
B. Njoman
,
D. Crouthamel
,
K. H. Chua
,
S. Y. Teo
,
Y. Y. Ma
Microelectron. Reliab., 2004

2003
Improving the deflection of wire bonds in stacked chip scale package (CSP).
[BibTeX]
[DOI]
Y. F. Yao
,
T. Y. Lin
,
K. H. Chua
Microelectron. Reliab., 2003

Development of the green plastic encapsulation for high density wirebonded leaded packages.
[BibTeX]
[DOI]
T. Y. Lin
,
C. M. Fang
,
Y. F. Yao
,
K. H. Chua
Microelectron. Reliab., 2003

Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages.
[BibTeX]
[DOI]
T. Y. Lin
,
K. L. Davison
,
W. S. Leong
,
Simon Chua
,
Y. F. Yao
,
J. S. Pan
,
J. W. Chai
,
K. C. Toh
,
W. C. Tjiu
Microelectron. Reliab., 2003

2002
The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method.
[BibTeX]
[DOI]
T. Y. Lin
,
W. S. Leong
,
K. H. Chua
,
R. Oh
,
Y. Miao
,
J. S. Pan
,
J. W. Chai
Microelectron. Reliab., 2002

2001
A Special Session on Granular Computing and Interval Computations at the 19th International Conference of the North American Fuzzy Information Processing Society (NAFIPS) Atlanta, Georgia, July 13-15, 2000.
[BibTeX]
[DOI]
T. Y. Lin
,
Vladik Kreinovich
Reliab. Comput., 2001

1996
Generalization of Rough Sets using Modal Logics.
[BibTeX]
[DOI]
Y. Y. Yao
,
T. Y. Lin
Intell. Autom. Soft Comput., 1996

Guest Editorial.
[BibTeX]
[DOI]
T. Y. Lin
Intell. Autom. Soft Comput., 1996

1994
Anomaly detection: a soft computing approach.
[BibTeX]
[DOI]
T. Y. Lin
Proceedings of the 1994 Workshop on New Security Paradigms, 1994

1993
Concurrent automata, database computers, and security: a "new" security paradigm for secure parallel processing.
[BibTeX]
[DOI]
T. Y. Lin
Proceedings of the Proceedings on the 1992-1993 Workshop on New Security Paradigms, 1993

Bell and LaPadula axioms: a "new" paradigm for an "old" model.
[BibTeX]
[DOI]
T. Y. Lin
Proceedings of the Proceedings on the 1992-1993 Workshop on New Security Paradigms, 1993

1989
Topological data models and approximate retrieval and reasoning.
[BibTeX]
[DOI]
T. Y. Lin
Proceedings of the Computer Trends in the 1990s, 1989

Extensions of pushdown automata and Petri nets.
[BibTeX]
[DOI]
T. Y. Lin
Proceedings of the Computer Trends in the 1990s, 1989

1988
Neighborhood systems and relational databases.
[BibTeX]
[DOI]
T. Y. Lin
Proceedings of the Sixteenth ACM Annual Conference on Computer Science, 1988


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