Siyu Wang

Orcid: 0009-0002-4389-7092

Affiliations:
  • Tokyo Institute of Technology, Yokohama, Kanagawa, Japan


According to our database1, Siyu Wang authored at least 6 papers between 2023 and 2025.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

Legend:

Book  In proceedings  Article  PhD thesis  Dataset  Other 

Links

Online presence:

On csauthors.net:

Bibliography

2025
Lightweight Fingernail Haptic Device: Unobstructed Fingerpad Force and Vibration Feedback for Enhanced Virtual Dexterous Manipulation.
IEEE Trans. Haptics, 2025

Group-Based Corotational FEM for Real-Time Large Deformation Simulation.
IEEE Access, 2025

Lightweight Wearable Fingertip Haptic Device with Tangential Force Feedback based on Finger Nail Stimulation.
Proceedings of the IEEE Conference on Virtual Reality and 3D User Interfaces, 2025

2024
Preserving Real-World Finger Dexterity Using a Lightweight Fingertip Haptic Device for Virtual Dexterous Manipulation.
CoRR, 2024

Optimizing Haptic Feedback in Virtual Reality: The Role of Vibration and Tangential Forces in Enhancing Grasp Response and Weight Perception.
Proceedings of the Haptics: Understanding Touch; Technology and Systems; Applications and Interaction, 2024

2023
Realistic Dexterous Manipulation of Virtual Objects with Physics-Based Haptic Rendering.
Proceedings of the ACM SIGGRAPH 2023 Emerging Technologies, 2023


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