Siyuan Miao
Orcid: 0009-0003-3813-141X
According to our database1,
Siyuan Miao authored at least 4 papers
between 2023 and 2026.
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Bibliography
2026
Multi-Level Interconnect Planning for Signal-Power-Thermal Integrity in 2.5D/3D Integration.
Proceedings of the 2026 International Symposium on Physical Design, 2026
2025
C2OPU: Hybrid Compute-in-Memory and Coarse-Grained Reconfigurable Architecture for Overlay Processing of Transformers.
Proceedings of the 33rd IEEE Annual International Symposium on Field-Programmable Custom Computing Machines, 2025
Proceedings of the 62nd ACM/IEEE Design Automation Conference, 2025
2023
Proceedings of the 33rd International Conference on Field-Programmable Logic and Applications, 2023