Sreejith Kochupurackal Rajan

According to our database, Sreejith Kochupurackal Rajan authored at least 4 papers between 2017 and 2022.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2022

Integrated Silicon Microfluidic Cooling of a High-Power Overclocked CPU for Efficient Thermal Management.

Sreejith Kochupurackal Rajan, Bharath Ramakrishnan, Husam Alissa, Washington Kim, Christian Belady, Muhannad S. Bakir

IEEE Access, 2022

2021

Electrical and Performance Benefits of Advanced Monolithic Cooling for 2.5D Heterogeneous ICs.

Sreejith Kochupurackal Rajan, Ankit Kaul, Gary S. May, Muhannad S. Bakir

Proceedings of the IEEE International 3D Systems Integration Conference, 2021

2019

High Density and Low-Temperature Interconnection Enabled by Mechanical Self-Alignment and Electroless Plating.

Sreejith Kochupurackal Rajan, Ming Jui Li, Muhannad S. Bakir, Gary S. May

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2017

Microfabrication, assembly, and hermetic packaging of mm-sized free-floating neural probes.

Pyungwoo Yeon, Joe L. Gonzalez, Muneeb Zia, Sreejith Kochupurackal Rajan, Gary S. May, Muhannad S. Bakir, Maysam Ghovanloo

Proceedings of the IEEE Biomedical Circuits and Systems Conference, 2017