Tingyu Lin

According to our database, Tingyu Lin authored at least 1 paper in 2018.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2018

Warpage simulation and experimental verification for 320 mm × 320 mm panel level fan-out packaging based on die-first process.

Meiying Su, Liqiang Cao, Tingyu Lin, Feng Chen, Jun Li, Cheng Chen, Gengxin Tian

Microelectron. Reliab., 2018