Liqiang Cao

According to our database, Liqiang Cao authored at least 18 papers between 2004 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2023

Long-distance and anti-disturbance wireless power transfer based on concentric three-coil resonator and inhomogeneous electromagnetic metamaterials.

Huilin An, Jian Yuan, Jun Li, Liqiang Cao

Int. J. Circuit Theory Appl., May, 2023

2022

HY-DBSCAN: A hybrid parallel DBSCAN clustering algorithm scalable on distributed-memory computers.

Guoqing Wu, Liqiang Cao, Hongyun Tian, Wei Wang

J. Parallel Distributed Comput., 2022

Research on Ni₃Sn₄ intermetallic compound for 5μm diameter Cu/Ni/Sn-3.0Ag micro bumps.

Fengwei Dai, David Wei Zhang, Yangyang Yan, Guojun Wang, Liqiang Cao

IEICE Electron. Express, 2022

Antenna in package design and measurement for millimeter-wave applications in fan-out wafer-level package.

Ying Chen, Jun Li, Fei Ding, Liqiang Cao

IEICE Electron. Express, 2022

2021

Design of a Ka-band receiver front end using Si-based system in package.

Hanxiang Zhu, Jun Li, Qidong Wang, Liqiang Cao

IEICE Electron. Express, 2021

Si-based Ka-band SIW band-pass filter using wafer level manufacturing process.

Hanxiang Zhu, Jun Li, Liqiang Cao, Jia Cao, Pengwei Chen

IEICE Electron. Express, 2021

An optimization method for conformal shielding.

Jian Yuan, Jun Li, Jia Cao, Pengwei Chen, Liqiang Cao, Tianchun Ye

IEICE Electron. Express, 2021

Si-based system-in-package design with broadband interconnection for E-band applications.

Jiao Chu, Jun Li, Yunyan Zhou, Jia Cao, Pengwei Chen, Liqiang Cao

IEICE Electron. Express, 2021

2019

A Performance Analysis of Large Scale Scientific Computing Applications from Log Archives.

Liqiang Cao, Xu Liu, Xiaowen Xu, Zhanjun Liu

Proceedings of the IEEE International Parallel and Distributed Processing Symposium Workshops, 2019

2018

Warpage simulation and experimental verification for 320 mm × 320 mm panel level fan-out packaging based on die-first process.

Meiying Su, Liqiang Cao, Tingyu Lin, Feng Chen, Jun Li, Cheng Chen, Gengxin Tian

Microelectron. Reliab., 2018

2017

Experimental and numerical study of 3D stacked dies under forced air cooling and water immersion cooling.

Delong Qiu, Liqiang Cao, Qidong Wang, Fengze Hou, Xugang Wang

Microelectron. Reliab., 2017

Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate.

Cheng Chen, Fengze Hou, Fengman Liu, Qian She, Liqiang Cao, Lixi Wan

Microelectron. Reliab., 2017

Study on Magnetic Probe Calibration in Near-field Measurement System for EMI Application.

Gengxin Tian, Jun Li, Xiaofang Liu, Lixi Wan, Liqiang Cao

J. Electron. Test., 2017

2016

Optimization and validation of thermal management for a RF front-end SiP based on rigid-flex substrate.

Peng Wu, Fengze Hou, Cheng Chen, Jun Li, Fengman Liu, Jing Zhang, Liqiang Cao, Lixi Wan

Microelectron. Reliab., 2016

Design of a compact silicon-based integrated passive band-pass filter with two tunable finite transmission zeros.

Jie Pan, Huijuan Wang, Gengxin Tian, Liqiang Cao, Daquan Yu

Microelectron. J., 2016

2008

Jetter: a multi-pattern parallel I/O benchmark.

Liqiang Cao, Hongbing Luo, Baoyin Zhang

Proceedings of the 2008 IEEE International Conference on Cluster Computing, 29 September, 2008

2006

A Framework for Data Management and Transfer in Grid Environments.

Haojie Zhou, Xingwu Liu, Liqiang Cao, Li Zha

Proceedings of the Embedded and Ubiquitous Computing, International Conference, 2006

2004

Design and Implementation of Grid File Management System Hotfile.

Liqiang Cao, Jie Qiu, Li Zha, Haiyan Yu, Wei Li, Yuzhong Sun

Proceedings of the Grid and Cooperative Computing, 2004