Tobias Grözinger

Orcid: 0000-0002-1826-3592

According to our database1, Tobias Grözinger authored at least 6 papers between 2017 and 2021.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

On csauthors.net:

Bibliography

2021
Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane.
Sensors, 2021

2019
A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation.
IEEE Access, 2019

2018
Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation.
Microelectron. Reliab., 2018

Effect of Joule heating on the reliability of solder joints under power cycling conditions.
Microelectron. Reliab., 2018

Reliability Study and Thermal Performance of LEDs on Molded Interconnect Devices (MID) and PCB.
IEEE Access, 2018

2017
Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates.
IEEE Trans. Reliab., 2017


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