Tongshuai Wu

Orcid: 0000-0003-3839-1660

According to our database1, Tongshuai Wu authored at least 11 papers between 2020 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Bibliography

2024
UltraVCS: Ultra-Fine-Grained Variable-Based Code Slicing for Automated Vulnerability Detection.
IEEE Trans. Inf. Forensics Secur., 2024

CDNM: Clustering-Based Data Normalization Method For Automated Vulnerability Detection.
Comput. J., 2024

2023
Identify Vulnerability Types: A Cross-Project Multiclass Vulnerability Classification System Based on Deep Domain Adaptation.
Proceedings of the Neural Information Processing - 30th International Conference, 2023

Code Property Graph based Vulnerability Type Identification with Fusion Representation.
Proceedings of the 26th International Conference on Computer Supported Cooperative Work in Design, 2023

Cross Domain on Snippets: BiLSTM-TextCNN based Vulnerability Detection with Domain Adaptation.
Proceedings of the 26th International Conference on Computer Supported Cooperative Work in Design, 2023

2022
BERT-Based Vulnerability Type Identification with Effective Program Representation.
Proceedings of the Wireless Algorithms, Systems, and Applications, 2022

BHMVD: Binary Code-based Hybrid Neural Network for Multiclass Vulnerability Detection.
Proceedings of the IEEE Intl Conf on Parallel & Distributed Processing with Applications, 2022

Automated Vulnerable Codes Mutation through Deep Learning for Variability Detection.
Proceedings of the International Joint Conference on Neural Networks, 2022

Inductive Vulnerability Detection via Gated Graph Neural Network.
Proceedings of the 25th IEEE International Conference on Computer Supported Cooperative Work in Design, 2022

2021
Self-Attention based Automated Vulnerability Detection with Effective Data Representation.
Proceedings of the 2021 IEEE Intl Conf on Parallel & Distributed Processing with Applications, Big Data & Cloud Computing, Sustainable Computing & Communications, Social Computing & Networking (ISPA/BDCloud/SocialCom/SustainCom), New York City, NY, USA, September 30, 2021

2020
Modeling and Application of Complex Soil Structure Influenced by Grounding Device of Tower.
Proceedings of the IEEE Industry Applications Society Annual Meeting, 2020


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