Toshitaka Ishizaki

According to our database, Toshitaka Ishizaki authored at least 6 papers between 2013 and 2017.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2017

Young's modulus of a sintered Cu joint and its influence on thermal stress.

Toshitaka Ishizaki, D. Miura, A. Kuno, K. Hasegawa, Masanori Usui, Y. Yamada

Microelectron. Reliab., 2017

2016

Power cycle reliability of Cu nanoparticle joints with mismatched coefficients of thermal expansion.

Toshitaka Ishizaki, Daiki Miura, Atsuki Kuno, Ryota Nagao, Syoho Aoki, Yuta Ohshima, Takuma Kino, Masanori Usui, Yasushi Yamada

Microelectron. Reliab., 2016

2015

Thermal simulation of joints with high thermal conductivities for power electronic devices.

Toshitaka Ishizaki, Masashi Yanase, A. Kuno, T. Satoh, Masanori Usui, F. Osawa, Yasushi Yamada

Microelectron. Reliab., 2015

Thermal cycle reliability of Cu-nanoparticle joint.

Toshitaka Ishizaki, Masanori Usui, Y. Yamada

Microelectron. Reliab., 2015

2014

Reliability of Cu nanoparticle joint for high temperature power electronics.

Toshitaka Ishizaki, A. Kuno, A. Tane, Masashi Yanase, F. Osawa, T. Satoh, Yasushi Yamada

Microelectron. Reliab., 2014

2013

Thermal characterizations of Cu nanoparticle joints for power semiconductor devices.

Toshitaka Ishizaki, T. Satoh, A. Kuno, A. Tane, Masashi Yanase, F. Osawa, Yasushi Yamada

Microelectron. Reliab., 2013