Toyohiro Chikyow

According to our database, Toyohiro Chikyow authored at least 4 papers between 2015 and 2021.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2021

Evidence-based recommender system for high-entropy alloys.

Minh-Quyet Ha, Duong-Nguyen Nguyen, Viet Cuong Nguyen, Takahiro Nagata, Toyohiro Chikyow, Hiori Kino, Takashi Miyake, Thierry Denoeux, Van-Nam Huynh, Hieu-Chi Dam

Nat. Comput. Sci., 2021

2019

Photoelectroscopic Study of Mn Barrier Layer on SiO2 for Si Wafer Bonding Process.

Takahiro Nagata, Kazumichi Tsumura, Kenro Nakamura, Kengo Uchida, Jin Kawakita, Toyohiro Chikyow, Kazuyuki Higashi

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2016

Conductive polymer/metal composite for flexible interconnect.

Jin Kawakita, Toyohiro Chikyow

Proceedings of the International Conference on IC Design and Technology, 2016

2015

Fast filling of through-silicon via (TSV) with conductive polymer/metal composites.

Jin Kawakita, Barbara Horváth, Toyohiro Chikyow

Proceedings of the 2015 International 3D Systems Integration Conference, 2015