Vincent Bley

According to our database, Vincent Bley authored at least 9 papers between 2012 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2023

New Self-Healing Dielectric for High-Reliability, High-Performance PCB-Embedding Materials for Power Electronics Applications.

Baptiste Arati, Vincent Bley, Pierre-Yves Pichon, Gilbert Teyssedre

IEEE Access, 2023

2018

Lock-in thermography for defect localization and thermal characterization for space application.

Morgane Mousnier, Kévin Sanchez, Elsa Locatelli, Thierry Lebey, Vincent Bley

Microelectron. Reliab., 2018

Packaging with Double-Side Cooling Capability for SiC Devices, Based on Silver Sintering.

Cyril Buttay, Raphel Riva, Bruno Allard, Marie-Laure Locatelli, Vincent Bley

Proceedings of the IECON 2018, 2018

2017

Using the variable width in a planar inductor on Kapton for optimizing its performance.

Hayet Kharbouch, Azzedine Hamid, Thierry Lebey, Vincent Bley, Léon Havez, Celine Combette

Turkish J. Electr. Eng. Comput. Sci., 2017

2016

Design of a New Electrical Model of Integrated LC Filter in DC-DC Converter.

A. Bensaci, Azzedine Hamid, A. Flitti, Thierry Lebey, Vincent Bley, Fatima Zohra Medjaoui

J. Low Power Electron., 2016

2015

Magnetic imaging for resistive, capacitive and inductive devices; from theory to piezo actuator failure localization.

Nicolas Courjault, Philippe Perdu, Fulvio Infante, Thierry Lebey, Vincent Bley

Microelectron. Reliab., 2015

Thermal Modeling of an Integrated Inductor in a Micro-Converter.

A. Allaoui, Azzedine Hamid, Pierre Spitéri, Vincent Bley, Thierry Lebey

J. Low Power Electron., 2015

2014

Integrated dc-dc based-GaN converter with screen printed capacitors allowing double side cooling.

Olivier Goualard, Nicolas Videau, Thierry Meynard, Thi Bang Doan, Thierry Lebey, Vincent Bley, Emmanuel Sarraute

Proceedings of the IECON 2014 - 40th Annual Conference of the IEEE Industrial Electronics Society, Dallas, TX, USA, October 29, 2014

2012

PCB dual-switch fuse with energetic materials embedded: Application for new fail-safe and fault-tolerant converters.

Zhifeng Dou, Frédéric Richardeau, Emmanuel Sarraute, Vincent Bley, Jean-Marc Blaquière, Claire Vella, Gilles Gonthier

Microelectron. Reliab., 2012