Vladimir Mashkovtsev

According to our database1, Vladimir Mashkovtsev authored at least 2 papers in 2015.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Links

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Bibliography

2015
A DLL-based test solution for through silicon via (TSV) in 3D-stacked ICs.
Proceedings of the 2015 IEEE International Test Conference, 2015

DLL based test solution for interposers in 2.5-D ICs.
Proceedings of the 2015 IEEE International Symposium on Circuits and Systems, 2015


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