Wenwen Chai

According to our database, Wenwen Chai authored at least 3 papers between 2009 and 2013.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2013

Direct Matrix Solution of Linear Complexity for Surface Integral-Equation-Based Impedance Extraction of Complicated 3-D Structures.

Wenwen Chai, Dan Jiao

Proc. IEEE, 2013

2011

Direct matrix solution of linear complexity for surface integral-equation based impedance extraction of high bandwidth interconnects.

Wenwen Chai, Dan Jiao

Proceedings of the 48th Design Automation Conference, 2011

2009

A direct integral-equation solver of linear complexity for large-scale 3D capacitance and impedance extraction.

Wenwen Chai, Dan Jiao, Cheng-Kok Koh

Proceedings of the 46th Design Automation Conference, 2009