Xiangning Lu

According to our database, Xiangning Lu authored at least 13 papers between 2013 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2023

Near-Space Wide-Area and High-Resolution Imaging System Design and Implementation.

Zhanchao Wang, Min Huang, Lulu Qian, Yan Sun, Xiangning Lu, Wenhao Zhao, Zixuan Zhang, Guangming Wang, Yixin Zhao

Sensors, July, 2023

Mechanical Shutter Testing System Design and Signal Processing Based on LabVIEW.

Xiangning Lu, Lulu Qian, Zhanchao Wang, Wei Han, Min Huang, Zixuan Zhang

Proceedings of the IEEE International Conference on Signal Processing, 2023

2022

Improved Active Disturbance Rejection Double Closed-Loop Control of a Rotary-Type VCM in a Moving Mirror Control System.

Liangjie Zhi, Min Huang, Wei Han, Zhanchao Wang, Xiangning Lu, Yang Bai, Han Gao

Sensors, 2022

2020

Simulation and Experimental Investigation on Active Thermography Test of the Solder Balls.

Libo Zhao, Zhenzhi He, Zengxiang Wang, Lei Su, Xiangning Lu

IEEE Trans. Ind. Informatics, 2020

2018

Detection of Micro Solder Balls Using Active Thermography Technology and K-Means Algorithm.

Xiangning Lu, Zhenzhi He, Lei Su, Mengying Fan, Fan Liu, Guanglan Liao, Tielin Shi

IEEE Trans. Ind. Informatics, 2018

2017

Using scanning acoustic microscopy and LM-BP algorithm for defect inspection of micro solder bumps.

Fan Liu, Lei Su, Mengying Fan, Jian Yin, Zhenzhi He, Xiangning Lu

Microelectron. Reliab., 2017

Principle and analysis of a rotational motion Fourier transform infrared spectrometer.

Qisheng Cai, Huang Min, Wei Han, Yixuan Liu, Lulu Qian, Xiangning Lu

Proceedings of the Earth Observing Systems XXII, 2017

2016

Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm.

Mengying Fan, Li Wei, Zhenzhi He, Wei Wei, Xiangning Lu

Microelectron. Reliab., 2016

2015

Genetic algorithms for defect detection of flip chips.

Lei Su, Tielin Shi, Li Du, Xiangning Lu, Guanglan Liao

Microelectron. Reliab., 2015

2014

A new gear fault feature extraction method based on hybrid time-frequency analysis.

Wenyi Liu, Jiguang Han, Xiangning Lu

Neural Comput. Appl., 2014

Using active thermography for defects inspection of flip chip.

Zhensong Xu, Tielin Shi, Xiangning Lu, Guanglan Liao

Microelectron. Reliab., 2014

2013

Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer.

Lei Su, Tielin Shi, Zhensong Xu, Xiangning Lu, Guanglan Liao

Sensors, 2013

A high speed railway control system based on the fuzzy control method.

Wenyi Liu, Jiguang Han, Xiangning Lu

Expert Syst. Appl., 2013