Zhenzhi He

According to our database, Zhenzhi He authored at least 13 papers between 2016 and 2026.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2026

Level Queue Perception-Based Quality of Service Optimization for Scraper Chain Tension Monitoring in Wireless Sensor Networks.

Xiaodong Yan, Gongbo Zhou, Liufan Fan, Shuang Cao, Ping Zhou, Qing Li, Lianfeng Han, Zhenzhi He

IEEE Trans. Netw. Sci. Eng., 2026

2025

Wafer Defect Detection Technology Based on CTM-IYOLOv10 Network.

Pengcheng Ji, Zhenzhi He, Weiwei Yang, Jiawei Du, Guo Ye, Xiangning Lu

J. Imaging, 2025

2023

A Power Allocation Method for Wireless Sensor Networks Based on Data Priority: A Case Study of Scraper Chain Tension Monitoring Network.

Xiaodong Yan, Gongbo Zhou, Ping Zhou, Wei Wang, Lianfeng Han, Zhenzhi He

IEEE Trans. Instrum. Meas., 2023

A Novel Competitive Temporal Convolutional Network for Remaining Useful Life Prediction of Rolling Bearings.

Wei Wang, Gongbo Zhou, Guoqing Ma, Xiaodong Yan, Ping Zhou, Zhenzhi He, Tianbing Ma

IEEE Trans. Instrum. Meas., 2023

A Transmission Power Distribution Method Based on Lyapunov for Scraper Chain Tension Monitoring Network.

Xiaodong Yan, Gongbo Zhou, Ping Zhou, Wei Wang, Lianfeng Han, Zhenzhi He

Proceedings of the IEEE Symposium on Computers and Communications, 2023

2021

Automatic Detection of Industrial Wire Rope Surface Damage Using Deep Learning-Based Visual Perception Technology.

Ping Zhou, Gongbo Zhou, Houlian Wang, Dongxu Wang, Zhenzhi He

IEEE Trans. Instrum. Meas., 2021

A Novel Wear Detection Method Based on FPC: A Case Study on the Hoisting Cage Sliding Sleeve.

Zhenzhi He, Xiaodong Yan, Yuan Sun, Wei Wang, Gongbo Zhou, Ping Zhou, Chaoquan Tang, Fan Jiang

IEEE Trans. Instrum. Meas., 2021

2020

Simulation and Experimental Investigation on Active Thermography Test of the Solder Balls.

Libo Zhao, Zhenzhi He, Zengxiang Wang, Lei Su, Xiangning Lu

IEEE Trans. Ind. Informatics, 2020

2019

Linear Permanent Magnet Eddy Current Brake for Overwinding Protection.

Panpan Yang, Gongbo Zhou, Zhencai Zhu, Chaoquan Tang, Zhenzhi He, Penghui Wang

IEEE Access, 2019

2018

Detection of Micro Solder Balls Using Active Thermography Technology and K-Means Algorithm.

Xiangning Lu, Zhenzhi He, Lei Su, Mengying Fan, Fan Liu, Guanglan Liao, Tielin Shi

IEEE Trans. Ind. Informatics, 2018

2017

Weighted Kernel Entropy Component Analysis for Fault Diagnosis of Rolling Bearings.

Hongdi Zhou, Tielin Shi, Guanglan Liao, Jianping Xuan, Jie Duan, Lei Su, Zhenzhi He, Wuxing Lai

Sensors, 2017

Using scanning acoustic microscopy and LM-BP algorithm for defect inspection of micro solder bumps.

Fan Liu, Lei Su, Mengying Fan, Jian Yin, Zhenzhi He, Xiangning Lu

Microelectron. Reliab., 2017

2016

Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm.

Mengying Fan, Li Wei, Zhenzhi He, Wei Wei, Xiangning Lu

Microelectron. Reliab., 2016