Xu Chen

According to our database, Xu Chen authored at least 6 papers between 2005 and 2015.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2015

Interfacial thermal stresses in ACF bonding assembly.

Li-Lan Gao, Xu Chen, Hong Gao

Microelectron. Reliab., 2015

2013

High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force.

Xin Li, Gang Chen, Xu Chen, Guo-Quan Lu, Lei Wang, Yun-Hui Mei

Microelectron. Reliab., 2013

Ratcheting behavior of sandwiched assembly joined by sintered nanosilver for power electronics packaging.

Gang Chen, Ze-Sheng Zhang, Yun-Hui Mei, Xin Li, Guo-Quan Lu, Xu Chen

Microelectron. Reliab., 2013

2011

Fatigue life evaluation of anisotropic conductive adhesive film joints under mechanical and hygrothermal loads.

Li-Lan Gao, Lei Wang, Hong Gao, Gang Chen, Xu Chen

Microelectron. Reliab., 2011

2006

Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnection.

Xu Chen, Jun Zhang, Chunlei Jiao, Yanmin Liu

Microelectron. Reliab., 2006

2005

Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling.

Y. C. Lin, Xu Chen, Xingsheng Liu, Guo-Quan Lu

Microelectron. Reliab., 2005