Guo-Quan Lu
Orcid: 0000-0003-3079-8589
According to our database1,
Guo-Quan Lu
authored at least 14 papers
between 2001 and 2023.
Collaborative distances:
Collaborative distances:
Awards
IEEE Fellow
IEEE Fellow 2018, "For development of materials and packaging technologies for power electronics modules".
Timeline
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Book In proceedings Article PhD thesis Dataset OtherLinks
On csauthors.net:
Bibliography
2023
Low Parasitic-Inductance Packaging of a 650 V/150 A Half-Bridge Module Using Enhancement-Mode Gallium-Nitride High Electron Mobility Transistors.
IEEE Trans. Ind. Electron., 2023
2021
Two-Dimensional Mapping of Interface Thermal Resistance by Transient Thermal Measurement.
IEEE Trans. Ind. Electron., 2021
2017
IEEE Trans. Ind. Electron., 2017
2016
Thermal characterization of planar high temperature power module packages with sintered nanosilver interconnection.
Microelectron. Reliab., 2016
2015
Thermal characterization system for transient thermal impedance measurement and power cycling of IGBT modules.
Microelectron. Reliab., 2015
Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate.
Microelectron. Reliab., 2015
Degradation of high power single emitter laser modules using nanosilver paste in continuous pulse conditions.
Microelectron. Reliab., 2015
2013
High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force.
Microelectron. Reliab., 2013
Ratcheting behavior of sandwiched assembly joined by sintered nanosilver for power electronics packaging.
Microelectron. Reliab., 2013
2005
Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling.
Microelectron. Reliab., 2005
2002
Microelectron. Reliab., 2002
2001
Microelectron. Reliab., 2001
Microelectron. Reliab., 2001
Microelectron. Reliab., 2001