Xue-Ru Guo

According to our database, Xue-Ru Guo authored at least 1 paper in 2015.

Collaborative distances:

• Dijkstra number of seven.
• Erdős number of six.

2015

Vacuum effect on the void formation of the molded underfill process in flip chip packaging.

Xue-Ru Guo, Wen-Bin Young

Microelectron. Reliab., 2015