Wen-Bin Young

According to our database, Wen-Bin Young authored at least 6 papers between 2003 and 2018.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2018

Application of lattice Boltzmann method in free surface flow simulation of micro injection molding.

Ying-Xuan Chen, Shing-Cheng Chang, Wen-Bin Young

Comput. Math. Appl., 2018

2015

Vacuum effect on the void formation of the molded underfill process in flip chip packaging.

Xue-Ru Guo, Wen-Bin Young

Microelectron. Reliab., 2015

2011

Development of a mathematical model for thermal-compression bonding of the COG packaging process using NCA.

Ching-Ho Chang, Wen-Bin Young

Microelectron. Reliab., 2011

2010

Modeling of a non-Newtonian flow between parallel plates in a flip chip encapsulation.

Wen-Bin Young

Microelectron. Reliab., 2010

2009

Experimental study of filling behaviors in the underfill encapsulation of a flip-chip.

Meng-Fu Shih, Wen-Bin Young

Microelectron. Reliab., 2009

2003

Anisotropic behavior of the capillary action in flip chip underfill.

Wen-Bin Young

Microelectron. J., 2003