Yang Wang

According to our database, Yang Wang authored at least 6 papers between 2022 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2025

Electrical and Thermal Characteristics Optimization in Interposer-Based 2.5-D Integrated Circuits.

Changle Zhi, Gang Dong, Deguang Yang, Daihang Liu, Yinghao Feng, Yang Wang, Zhangming Zhu

IEEE Trans. Very Large Scale Integr. Syst., March, 2025

2024

Thermal Modeling and Analysis of 3D ICS with Heat Dissipation Effect of Power Distribution Networks.

Yinghao Feng, Gang Dong, Daihang Liu, Changle Zhi, Deguang Yang, Yang Wang, Zhangming Zhu, Yintang Yang

J. Circuits Syst. Comput., November, 2024

Multiobjective Optimization for PSIJ Mitigation and Impedance Improvement Based on PCPS/DR-NSDE in Chiplet-Based 2.5-D Systems.

Changle Zhi, Gang Dong, Wei Xiong, Deguang Yang, Daihang Liu, Yinghao Feng, Yang Wang, Zhangming Zhu, Yintang Yang

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., August, 2024

2023

Miniaturization Strategy for Directional Couplers Based on Through-Silicon Via Insertion and Neuro-Transfer Function Modeling Method.

Wei Xiong, Gang Dong, Changle Zhi, Yang Wang, Zhangming Zhu, Yintang Yang

IEEE Trans. Very Large Scale Integr. Syst., November, 2023

2022

3-D Compact Marchand Balun Design Based on Through-Silicon via Technology for Monolithic and 3-D Integration.

Wei Xiong, Gang Dong, Yang Wang, Zhangming Zhu, Yintang Yang

IEEE Trans. Very Large Scale Integr. Syst., 2022

Trade-Off-Oriented Impedance Optimization of Chiplet-Based 2.5-D Integrated Circuits With a Hybrid MDP Algorithm for Noise Elimination.

Changle Zhi, Gang Dong, Yang Wang, Zhangming Zhu, Yintang Yang

IEEE Trans. Circuits Syst. I Regul. Pap., 2022