Yangyang Pan

According to our database1, Yangyang Pan authored at least 12 papers between 2009 and 2014.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2014
Using Lifetime-Aware Progressive Programming to Improve SLC NAND Flash Memory Write Endurance.
IEEE Trans. VLSI Syst., 2014

Energy Efficiency Performance Analysis of MAC Protocols in Wireless Sensor Networks.
Proceedings of the 12th International Conference on Advances in Mobile Computing and Multimedia, 2014

2013
DSP Systems Using Three-Dimensional Integration Technology.
Proceedings of the Handbook of Signal Processing Systems, 2013

Exploring the Use of Emerging Nonvolatile Memory Technologies in Future FPGAs.
IEEE Trans. VLSI Syst., 2013

Error Rate-Based Wear-Leveling for nand Flash Memory at Highly Scaled Technology Nodes.
IEEE Trans. VLSI Syst., 2013

Using Quasi-EZ-NAND Flash Memory to Build Large-Capacity Solid-State Drives in Computing Systems.
IEEE Trans. Computers, 2013

2012
Estimating Information-Theoretical nand Flash Memory Storage Capacity and its Implication to Memory System Design Space Exploration.
IEEE Trans. VLSI Syst., 2012

Quasi-nonvolatile SSD: Trading flash memory nonvolatility to improve storage system performance for enterprise applications.
Proceedings of the 18th IEEE International Symposium on High Performance Computer Architecture, 2012

2011
Exploiting Memory Device Wear-Out Dynamics to Improve NAND Flash Memory System Performance.
Proceedings of the 9th USENIX Conference on File and Storage Technologies, 2011

2010
DRAM-based FPGA enabled by three-dimensional (3d) memory stacking (abstract only).
Proceedings of the ACM/SIGDA 18th International Symposium on Field Programmable Gate Arrays, 2010

DSP Systems using Three-Dimensional (3D) Integration Technology.
Proceedings of the Handbook of Signal Processing Systems, 2010

2009
Improving VLIW Processor Performance Using Three-Dimensional (3D) DRAM Stacking.
Proceedings of the 20th IEEE International Conference on Application-Specific Systems, 2009


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