Yeong K. Kim

According to our database, Yeong K. Kim authored at least 5 papers between 2004 and 2017.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2017

Module packaging effects on MEMS airbag sensor performance for automobiles.

Dong Hyun Park, Sojin Shin, Yeong K. Kim

Microelectron. Reliab., 2017

2015

PBGA packaging reliability assessments under random vibrations for space applications.

Yeong K. Kim, Do Soon Hwang

Microelectron. Reliab., 2015

2011

Material property effects on solder failure analyses.

Yeong K. Kim, Jin Hyuk Gang, Bo-Young Lee

Microelectron. Reliab., 2011

2010

Warpage mechanism analyses of strip panel type PBGA chip packaging.

Yeong K. Kim, In Soo Park, Jooho Choi

Microelectron. Reliab., 2010

2004

Finite element simulation of package stress in transfer molded MEMS pressure sensors.

Rudolf Krondorfer, Yeong K. Kim, Jaeok Kim, Claes-Gøran Gustafson, Timothy C. Lommasson

Microelectron. Reliab., 2004