Yi-Ming Jen

Orcid: 0000-0002-7395-9429

According to our database¹, Yi-Ming Jen authored at least 2 papers between 2006 and 2011.

Collaborative distances:

Timeline

Book In proceedings Article PhD thesis Dataset Other

2011

Finite element based fatigue life estimation of the solder joints with effect of intermetallic compound growth.

[DOI]

Microelectron. Reliab., 2011

2006

Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packages.

[DOI]

Microelectron. Reliab., 2006