Yi-Ming Jen

According to our database, Yi-Ming Jen authored at least 2 papers between 2006 and 2011.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2011

Finite element based fatigue life estimation of the solder joints with effect of intermetallic compound growth.

Yung-Chuan Chiou, Yi-Ming Jen, Shih-Hsiang Huang

Microelectron. Reliab., 2011

2006

Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packages.

Yi-Ming Jen, Ying-Lung Wu, Chih-Kai Fang

Microelectron. Reliab., 2006