Yongle Huang
Orcid: 0000-0002-9711-1246
According to our database1,
Yongle Huang
authored at least 3 papers
between 2018 and 2023.
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Bibliography
2023
Characterization on the thermal field inside IGBT cells during switching based on TCAD modeling and Thermoreflectance imaging.
Microelectron. J., December, 2023
2021
Fatigue Mechanism of Die-Attach Joints in IGBTs Under Low-Amplitude Temperature Swings Based on 3D Electro-Thermal-Mechanical FE Simulations.
IEEE Trans. Ind. Electron., 2021
2018
Temperature monitoring inside IGBT modules at forward bias from the cross section and its finite element analysis.
Microelectron. Reliab., 2018