Yu-min Tsai

According to our database, Yu-min Tsai authored at least 1 paper in 2013.

Collaborative distances:

• Dijkstra number of seven.
• Erdős number of six.

2013

IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging.

Wen-Hwa Chen, Ching-Feng Yu, Hsien-Chie Cheng, Yu-min Tsai, Su-Tsai Lu

Microelectron. Reliab., 2013