According to our database1, Hsien-Chie Cheng authored at least 7 papers between 2006 and 2016.
Legend:Book In proceedings Article PhD thesis Other
Heat dissipation assessment of through silicon via (TSV)-based 3D IC packaging for CMOS image sensing.
Microelectronics Reliability, 2016
IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging.
Microelectronics Reliability, 2013
Crystal size and direction dependence of the elastic properties of Cu3Sn through molecular dynamics simulation and nanoindentation testing.
Microelectronics Reliability, 2012
Thermal-mechanical optimization of a novel nanocomposite-film typed flip chip technology.
Microelectronics Reliability, 2011
Modified Nosé-Hoover thermostat for solid state for constant temperature molecular dynamics simulation.
J. Comput. Physics, 2011
Development of three-dimensional chip stacking technology using a clamped through-silicon via interconnection.
Microelectronics Reliability, 2010
A web-based distributed problem-solving environment for engineering applications.
Advances in Engineering Software, 2006