Hsien-Chie Cheng

According to our database1, Hsien-Chie Cheng authored at least 7 papers between 2006 and 2016.

Collaborative distances:
  • Dijkstra number2 of six.
  • Erdős number3 of five.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2016
Heat dissipation assessment of through silicon via (TSV)-based 3D IC packaging for CMOS image sensing.
Microelectronics Reliability, 2016

2013
IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging.
Microelectronics Reliability, 2013

2012
Crystal size and direction dependence of the elastic properties of Cu3Sn through molecular dynamics simulation and nanoindentation testing.
Microelectronics Reliability, 2012

2011
Thermal-mechanical optimization of a novel nanocomposite-film typed flip chip technology.
Microelectronics Reliability, 2011

Modified Nosé-Hoover thermostat for solid state for constant temperature molecular dynamics simulation.
J. Comput. Physics, 2011

2010
Development of three-dimensional chip stacking technology using a clamped through-silicon via interconnection.
Microelectronics Reliability, 2010

2006
A web-based distributed problem-solving environment for engineering applications.
Advances in Engineering Software, 2006


  Loading...