Yun Huang

Affiliations:

China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou, China

According to our database¹, Yun Huang authored at least 2 papers between 2018 and 2020.

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2020

Simulation Analysis of Mechanical Response of Wire Bonding in SiP under Thermal-mechanical-electrical Coupling Load.

[BibT_eX]

[DOI]

Proceedings of the 2020 IEEE International Conference on Integrated Circuits, 2020

2018

The experimental analysis and the mechanical model for the debonding failure of TSV-Cu/Si interface.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2018