A. Buxbaum

According to our database, A. Buxbaum authored at least 1 paper in 2010.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2010

Post-bond sub-500 nm alignment in 300 mm integrated face-to-face wafer-to-wafer Cu-Cu thermocompression, Si-Si fusion and oxideoxide fusion bonding.

Weng Hong Teh, C. Deeb, J. Burggraf, D. Arazi, R. Young, C. Senowitz, A. Buxbaum

Proceedings of the IEEE International Conference on 3D System Integration, 2010