Weng Hong Teh

According to our database1, Weng Hong Teh authored at least 2 papers between 2009 and 2010.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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PhD thesis 
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Links

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Bibliography

2010
Post-bond sub-500 nm alignment in 300 mm integrated face-to-face wafer-to-wafer Cu-Cu thermocompression, Si-Si fusion and oxideoxide fusion bonding.
Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009
A route towards production-worthy 5 µm × 25 µm and 1 µm × 20 µm non-Bosch through-silicon-via (TSV) etch, TSV metrology, and TSV integration.
Proceedings of the IEEE International Conference on 3D System Integration, 2009


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