Bing Shi

IEEE Trans. Very Large Scale Integr. Syst., 2014

Optimized Micro-Channel Design for Stacked 3-D-ICs.

[BibT_eX]

[DOI]

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2014

A geometric approach to chip-scale TSV shield placement for the reduction of TSV coupling in 3D-ICs.

[BibT_eX]

[DOI]

Caleb Serafy

Integr., 2014

2013

Dynamic Thermal Management Under Soft Thermal Constraints.

[BibT_eX]

[DOI]

IEEE Trans. Very Large Scale Integr. Syst., 2013

Co-design of micro-fluidic heat sink and thermal through-silicon-vias for cooling of three-dimensional integrated circuit.

[BibT_eX]

[DOI]

Avram Bar-Cohen

IET Circuits Devices Syst., 2013

Micro-Fluidic Cooling for Stacked 3D-ICs: Fundamentals, Modeling and Design.

[BibT_eX]

[DOI]

Adv. Comput., 2013

Co-optimization of TSV assignment and micro-channel placement for 3D-ICs.

[BibT_eX]

[DOI]

Caleb Serafy

Proceedings of the Great Lakes Symposium on VLSI 2013 (part of ECRC), 2013

Thermal stress aware 3D-IC statistical static timing analysis.

[BibT_eX]

[DOI]

Proceedings of the Great Lakes Symposium on VLSI 2013 (part of ECRC), 2013

High performance 3D stacked DRAM processor architectures with micro-fluidic cooling.

[BibT_eX]

[DOI]

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2012

Thermal and Power-Aware Task Scheduling and Data Placement for Storage Centric Datacenters.

[BibT_eX]

[DOI]

Proceedings of the Handbook of Energy-Aware and Green Computing - Two Volume Set., 2012

Accelerating Gate Sizing Using Graphics Processing Units.

[BibT_eX]

[DOI]

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2012

Hybrid 3D-IC Cooling System Using Micro-fluidic Cooling and Thermal TSVs.

[BibT_eX]

[DOI]

Avram Bar-Cohen

Proceedings of the IEEE Computer Society Annual Symposium on VLSI, 2012

TSV-constrained micro-channel infrastructure design for cooling stacked 3D-ICs.

[BibT_eX]

[DOI]

Proceedings of the International Symposium on Physical Design, 2012

2011

Unified datacenter power management considering on-chip and air temperature constraints.

[BibT_eX]

[DOI]

Sustain. Comput. Informatics Syst., 2011

Liquid cooling for 3D-ICs.

[BibT_eX]

[DOI]

Proceedings of the 2011 International Green Computing Conference and Workshops, 2011

Non-uniform micro-channel design for stacked 3D-ICs.

[BibT_eX]

[DOI]

Peng Wang

Proceedings of the 48th Design Automation Conference, 2011

Cooling of 3D-IC using non-uniform micro-channels and sensor based dynamic thermal management.

[BibT_eX]

[DOI]

Proceedings of the 49th Annual Allerton Conference on Communication, 2011

2010

A statistical framework for designing on-chip thermal sensing infrastructure in nano-scale systems.

[BibT_eX]

[DOI]

Proceedings of the 2010 International Symposium on Physical Design, 2010

Dynamic thermal management for single and multicore processors under soft thermal constraints.

[BibT_eX]

[DOI]

Proceedings of the 2010 International Symposium on Low Power Electronics and Design, 2010

Thermal and power-aware task scheduling for Hadoop based storage centric datacenters.

[BibT_eX]

[DOI]