Caleb Serafy

According to our database, Caleb Serafy authored at least 16 papers between 2013 and 2019.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2019

Enhanced Phase-Driven Q-Learning-Based DRM for Multicore Processors.

Zhiyuan Yang, Caleb Serafy, Tiantao Lu, Ankur Srivastava

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2019

2017

TSV-Based 3-D ICs: Design Methods and Tools.

Tiantao Lu, Caleb Serafy, Zhiyuan Yang, Sandeep Kumar Samal, Sung Kyu Lim, Ankur Srivastava

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2017

Design Space Modeling and Simulation for Physically Constrained 3D CPUs.

Caleb Serafy, Zhiyuan Yang, Ankur Srivastava

Proceedings of the on Great Lakes Symposium on VLSI 2017, 2017

Phase-driven Learning-based Dynamic Reliability Management For Multi-core Processors.

Zhiyuan Yang, Caleb Serafy, Tiantao Lu, Ankur Srivastava

Proceedings of the 54th Annual Design Automation Conference, 2017

2016

Unlocking the True Potential of 3-D CPUs With Microfluidic Cooling.

Caleb Serafy, Avram Bar-Cohen, Ankur Srivastava, Donald Yeung

IEEE Trans. Very Large Scale Integr. Syst., 2016

Security and Vulnerability Implications of 3D ICs.

Yang Xie, Chongxi Bao, Caleb Serafy, Tiantao Lu, Ankur Srivastava, Mark M. Tehranipoor

IEEE Trans. Multi Scale Comput. Syst., 2016

Thermoelectric Codesign of 3-D CPUs and Embedded Microfluidic Pin-Fin Heatsinks.

Caleb Serafy, Zhiyuan Yang, Ankur Srivastava, Yuanchen Hu, Yogendra Joshi

IEEE Des. Test, 2016

Voltage Noise Induced DRAM Soft Error Reduction Technique for 3D-CPUs.

Tiantao Lu, Caleb Serafy, Zhiyuan Yang, Ankur Srivastava

Proceedings of the 2016 International Symposium on Low Power Electronics and Design, 2016

ECO Based Placement and Routing Framework for 3D FPGAs with Micro-fluidic Cooling.

Zhiyuan Yang, Caleb Serafy, Ankur Srivastava

Proceedings of the 24th IEEE Annual International Symposium on Field-Programmable Custom Computing Machines, 2016

2015

TSV Replacement and Shield Insertion for TSV-TSV Coupling Reduction in 3-D Global Placement.

Caleb Serafy, Ankur Srivastava

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2015

2014

A geometric approach to chip-scale TSV shield placement for the reduction of TSV coupling in 3D-ICs.

Caleb Serafy, Bing Shi, Ankur Srivastava

Integr., 2014

Coupling-aware force driven placement of TSVs and shields in 3D-IC layouts.

Caleb Serafy, Ankur Srivastava

Proceedings of the International Symposium on Physical Design, 2014

Unlocking the true potential of 3D CPUs with micro-fluidic cooling.

Caleb Serafy, Ankur Srivastava, Donald Yeung

Proceedings of the International Symposium on Low Power Electronics and Design, 2014

2013

Co-optimization of TSV assignment and micro-channel placement for 3D-ICs.

Bing Shi, Caleb Serafy, Ankur Srivastava

Proceedings of the Great Lakes Symposium on VLSI 2013 (part of ECRC), 2013

Online TSV health monitoring and built-in self-repair to overcome aging.

Caleb Serafy, Ankur Srivastava

Proceedings of the 2013 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems, 2013

High performance 3D stacked DRAM processor architectures with micro-fluidic cooling.

Caleb Serafy, Bing Shi, Ankur Srivastava, Donald Yeung

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013