Bo Wan

Orcid: 0000-0003-1460-3614

Affiliations:

Beihang University, Beijing, China

According to our database¹, Bo Wan authored at least 4 papers between 2020 and 2025.

Collaborative distances:

Dijkstra number² of five.
Erdős number³ of five.

Timeline

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Book In proceedings Article PhD thesis Dataset Other

Bibliography

2025

Research on BHAST Test Method for Plastic Encapsulated Microcircuit.

[BibT_eX]

[DOI]

IEEE Access, 2025

2021

PRNU Estimation of Linear CMOS Image Sensors That Allows Nonuniform Illumination.

[BibT_eX]

[DOI]

IEEE Trans. Instrum. Meas., 2021

Research on IGBT Bonding Wires Crack Propagation at the Macro and Micro Scales.

[BibT_eX]

[DOI]

IEEE Access, 2021

2020

Reliability Evaluation of Multi-Mechanism Failure for Semiconductor Devices Using Physics-of-Failure Technique and Maximum Entropy Principle.

[BibT_eX]

[DOI]

IEEE Access, 2020

Bo Wan

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On csauthors.net:

Bibliography

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