Byung-Hyun Kwak

According to our database1, Byung-Hyun Kwak authored at least 2 papers in 2011.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2011
Electrical Reliability of Cu/Sn Micro-bump in Wafer Level Packaging for BioMEMS Devices.
Proceedings of the BIODEVICES 2011, 2011

Current stressing effect on interfacial reaction characteristics of Cu pillar/Sn-3.5Ag microbumps for 3D integration.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011


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